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IC Chip CPU NAND BGA Remover 14 Set Thin Blade Knife for Mobile iPhone Repair
> This is the perfect Tool for Electronics BGA Reapairs, Extracting CPU, NAND IC's on iPhone Logic Boards. Very helpful for remove epoxy glue around BGA Chips.
> WATCH VIDEO - HOW USEFUL WHEN REPAIR MOBILE PHONE "https://youtu.be/oh30Y5DVVO4"
> High Temperature Resistant.
> Safely Remove NAND & CPU. Remove Epoxy Glue Around BGA Chips.
> 16 Pieces Blades With Storage Box.
|- Note : We are not responsible for any damage caused while attempting any repairs.|