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In stock
More than 10 available
SKU
TO0015N
£3.89
£3.24
This is the perfect Tool for Electronics BGA Reapairs, Extracting CPU, NAND IC's on iPhone Logic Boards. Very helpful for remove epoxy glue around BGA Chips.
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IC Chip CPU NAND BGA Remover 14 Set Thin Blade Knife for Mobile iPhone Repair
| > This is the perfect Tool for Electronics BGA Reapairs, Extracting CPU, NAND IC's on iPhone Logic Boards. Very helpful for remove epoxy glue around BGA Chips. > WATCH VIDEO - HOW USEFUL WHEN REPAIR MOBILE PHONE "https://youtu.be/oh30Y5DVVO4" > High Temperature Resistant. > Safely Remove NAND & CPU. Remove Epoxy Glue Around BGA Chips. > 16 Pieces Blades With Storage Box. | ||
| Brand | TechZone | |
| Model | ||
| Colour | ||
| EAN | 5060549571510 | |
| MPN | TZAP0015N | |
| Compatible Brands | ||
| Compatible Models | ||
| - | ||
| - Note : We are not responsible for any damage caused while attempting any repairs. | ||
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