In stock
More than 10 available
SKU
TO0015N
£3.89 £3.24
This is the perfect Tool for Electronics BGA Reapairs, Extracting CPU, NAND IC's on iPhone Logic Boards. Very helpful for remove epoxy glue around BGA Chips.
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17 hours & 54 minutes

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> This is the perfect Tool for Electronics BGA Reapairs, Extracting CPU, NAND IC's on iPhone Logic Boards. Very helpful for remove epoxy glue around BGA Chips.

> WATCH VIDEO - HOW USEFUL WHEN REPAIR MOBILE PHONE "https://youtu.be/oh30Y5DVVO4"

> High Temperature Resistant.

> Safely Remove NAND & CPU. Remove Epoxy Glue Around BGA Chips.

> 16 Pieces Blades With Storage Box.

Brand  TechZone
Model
Colour
EAN 5060549571510
MPN TZAP0015N
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- Note : We are not responsible for any damage caused while attempting any repairs.
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