We use cookies to make your experience better. To comply with the new e-Privacy directive, we need to ask for your consent to set the cookies. Learn more.
In stock
More than 10 available
SKU
TO0035N
£24.99
£20.82
MIJING 3D Direct Heat BGA Stencil is a High Precision BGA Reballing Template for Apple iPhone 6S & 6S Plus
Order Within
18 hours
for dispatch by Tomorrow
Related Products
Check items to add to the cart or
A9 Direct Heat BGA 3D Stencil for Apple iPhone 6s & 6s Plus IC Reballing
| > MIJING 3D Direct Heat BGA Stencil is a High Precision BGA Reballing Template for Apple iPhone 6S & 6S Plus > Unique 3D Groove Design. No Need to Calibrate > Square Holes, High Accuracy > See description for videos of 3D Stencil usage > Same Product We use in our Service Centre | ||
| Brand | MIJING | |
| Model | A9 | |
| Colour | ||
| EAN | 5060549572395 | |
| MPN | A9 | |
| Compatible Brands | For Apple | |
| Compatible Models | For iPhone 6s Plus For iPhone 6s | |
| - | ||
| - Note : We are not responsible for any damage caused while attempting any repairs. | ||
Write Your Own Review
We found other products you might like!
Are are looking to buy products in big quantities ?
we can help you out.
Contact Us
Professional Tools to Carryout all Repair Works
Browse Tools & Accessories
My Wish List