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In stock
More than 10 available
SKU
TO0035N
£24.99
£20.82
MIJING 3D Direct Heat BGA Stencil is a High Precision BGA Reballing Template for Apple iPhone 6S & 6S Plus
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A9 Direct Heat BGA 3D Stencil for Apple iPhone 6s & 6s Plus IC Reballing
| > MIJING 3D Direct Heat BGA Stencil is a High Precision BGA Reballing Template for Apple iPhone 6S & 6S Plus > Unique 3D Groove Design. No Need to Calibrate > Square Holes, High Accuracy > See description for videos of 3D Stencil usage > Same Product We use in our Service Centre | ||
| Brand | MIJING | |
| Model | A9 | |
| Colour | ||
| EAN | 5060549572395 | |
| MPN | A9 | |
| Compatible Brands | For Apple | |
| Compatible Models | For iPhone 6s Plus For iPhone 6s | |
| - | ||
| - Note : We are not responsible for any damage caused while attempting any repairs. | ||
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