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MIJING High Precision A11 CPU Reballing Direct Heat BGA Stencil for iPhone X, iPhone 8 & iPhone 8 Plus
> High Precision Direct Heat BGA Stencil is BGA Reballing Template for Apple iPhone X, 8 & 8 Plus. This is a must tool for reballing ic's on iPhone logic boards.
> Laser Cut, Supports Direct Heat.
> Supported Logic Board : iPhone 8, iPhone 8 Plus, iPhone X
> This is a must tool for reballing ic's on iPhone / iPad Logic Boards.
> This is a Professional tool ideal for Repair Centres and Micro BGA Mobile Phone Technicians.
|Compatible Brands||For Apple|
|Compatible Models||For iPhone 8 For iPhone 8 Plus For iPhone X|
|- Note : We are not responsible for any damage caused while attempting any repairs.|