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MIJING High Precision BGA IC Chip Reballing Direct Heat Stencil for iPhone 6 & iPhone 6 Plus
High Precision Direct Heat BGA Stencil is BGA Reballing Template for Apple iPhone 6 & 6 Plus.
This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing Apple iPhone 6 & 6 Plus ICs
Laser Cut, Supports Direct Heat.
Supported Logic Board : for Apple iPhone 6 & 6 Plus.
|Compatible Brands||For Apple|
|Compatible Models|| |
for iPhone 6
for iPhone 6 Plus
|- Note : We are not responsible for any damage caused while attempting any repairs.|