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In stock
More than 10 available
SKU
TO0088N
This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing iPhone 7 & 7 Plus All Chips
£5.99
£4.99
Order Within
19 hours & 4 minutes
for dispatch by Tomorrow
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MIJING High Precision BGA IC Chip Reballing Direct Heat Stencil for iPhone 7 & iPhone 7 Plus
| High Precision Direct Heat BGA Stencil is BGA Reballing Template for Apple iPhone 7 & 7 Plus. This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing Apple iPhone 7 & 7 Plus ICs Laser Cut, Supports Direct Heat. Supported Logic Board : for Apple iPhone 7 & 7 Plus.
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| Brand | TechZone | |
| Model | iPH-3 | |
| EAN | 5060549575884 | |
| MPN | iPH-3 | |
| Compatible Brands | For Apple | |
| Compatible Models | for iPhone 7 for iPhone 7 Plus
| |
| - | ||
| - Note : We are not responsible for any damage caused while attempting any repairs. | ||
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