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More than 10 available
SKU
TO0088N
This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing iPhone 7 & 7 Plus All Chips
£5.99 £4.99
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23 hours & 8 minutes

for dispatch on Monday

 High Precision Direct Heat BGA Stencil is BGA Reballing Template for Apple iPhone 7 & 7 Plus.

 This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing Apple iPhone 7 & 7 Plus ICs

 Laser Cut, Supports Direct Heat.

 Supported Logic Board : for Apple iPhone 7 & 7 Plus.

 

Brand  TechZone
Model iPH-3
EAN 5060549575884
MPN iPH-3
Compatible Brands For Apple
Compatible Models

for iPhone 7 

for iPhone 7 Plus 

 

 

 

 

 

 

 

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- Note : We are not responsible for any damage caused while attempting any repairs.
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