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MIJING High Precision BGA Reballing Direct Heat Stencil for iPhone 6S iPhone 6S Plus All Chips including A9 CPU
High Precision Direct Heat BGA Stencil is BGA Reballing Template for Apple iPhone 6S , 6S Plus All chips including A9 CPU.
This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing iPhone 6s Chips
Laser Cut, Supports Direct Heat.
Supported Logic Board : iPhone 6S / iPhone 6S Plus
|Compatible Brands||For Apple|
|Compatible Models|| |
For iPhone 6s
For iPhone 6s Plus
|- Note : We are not responsible for any damage caused while attempting any repairs.|