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SKU
TO0084N
This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing iPhone 6s & 6s Plus All Chips including A9 CPU
£5.99 £4.99
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 High Precision Direct Heat BGA Stencil is BGA Reballing Template for Apple iPhone 6S , 6S Plus All chips including A9 CPU.

 This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing iPhone 6s Chips

 Laser Cut, Supports Direct Heat.

 Supported Logic Board : iPhone 6S / iPhone 6S Plus

 

Brand  TechZone
Model iPH-2
EAN 5060549575846
MPN iPH-2
Compatible Brands For Apple
Compatible Models

For iPhone 6s 

For iPhone 6s Plus 

 

 

 

 

 

 

 

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- Note : We are not responsible for any damage caused while attempting any repairs.
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