In stock
Only 2 left
SKU
TO0083N
This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing iPhone CPU
£5.99 £4.99
Shipping
Order Within

2 hours & 41 minutes

for dispatch Today

 High Precision Direct Heat BGA Stencil is BGA Reballing Template for Apple iPhone A8 A9 A10 A11 CPU

 This professional tool ideal for Repair Centres and Micro BGA Mobile Phone technicians for reballing iPhone CPU

 Laser Cut, Supports Direct Heat.

 Supported Logic Board : A8 CPU - iPhone 6 & 6 Plus, A9 CPU - iPhone 6S & 6S Plus, A10 CPU - iPhone 7 & 7 Plus, A11 CPU - iPhone 8 & 8 Plus

 

Brand  TechZone
Model iPH-5
EAN 5060549575839
MPN iPH-5
Compatible Brands For Apple
Compatible Models

For iPhone 6 

For iPhone 6 Plus 

For iPhone 6s 

For iPhone 6s Plus 

For iPhone 7 

For iPhone 7 Plus 

For iPhone 8 

For iPhone 8 Plus 

 

-
 
- Note : We are not responsible for any damage caused while attempting any repairs.
Write Your Own Review
You're reviewing:MIJING High Precision BGA Reballing Direct Heat Stencil for iPhone A8 A9 A10 A11 CPU
Your Rating
We found other products you might like!
To Top