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MIJING High Precision BGA Reballing Direct Heat Stencil Samsung Glaxy S8, S8 Plus & Note 8
High Precision Direct Heat BGA Stencil is BGA Reballing Template for Samsung Galaxy S8, S8 Plus & Note 8 boards.
Laser Cut, Supports Direct Heat.
Supported Logic Board : Samsung Galaxy S8, S8 Plus & Note 8
This is a must tool for reballing ic's on Samsung Logic Boards.
This is a Professional tool ideal for Repair Centres and Micro BGA Mobile Phone Technicians.
|Compatible Brands||For Samsung|
|Compatible Models|| |
For Samsung Galaxy S8
For Samsung Galaxy S8 Plus
For Samsung Galaxy Note 8
|- Note : We are not responsible for any damage caused while attempting any repairs.|