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In stock
Only 8 left
SKU
TO0074N
£14.99
£12.49
QIANLI underfill glue cleaner tool with 3 blades designed to remove underfill glue around the IC chips on logic boards.
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QIANLI Underfill Glue Cleaner with 3 cold steel Blades for iPhone BGA IC Repair
| > QIANLI underfill glue cleaner tool with 3 blades designed to remove underfill glue around the IC chips on logic boards. > 0.1mm - 0.3mm Thickness for accurate handling. > Manufacturer : QIANLI TOOLPLUS, Manufacturer part no : 008, Material : stainless steel & Aluminium alloy, Colour : Gold & Grey > Cold steel blades. Designed for electronic BGA repairs. > Package contains : 1 x QIANLI TOOLPLUS 008 Non-slip stainless steel handle & 3 x QIANLI TOOLPLUS 008 cold steel blades | ||
| Brand | QIANLI | |
| Model | 008 | |
| Colour | Gold & Grey | |
| EAN | 5060549575099 | |
| MPN | 008 | |
| Compatible Brands | ||
| Compatible Models | ||
| - | ||
| - Note : We are not responsible for any damage caused while attempting any repairs. | ||
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