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QIANLI Underfill Glue Cleaner with 3 cold steel Blades for iPhone BGA IC Repair
> QIANLI underfill glue cleaner tool with 3 blades designed to remove underfill glue around the IC chips on logic boards.
> 0.1mm - 0.3mm Thickness for accurate handling.
> Manufacturer : QIANLI TOOLPLUS, Manufacturer part no : 008, Material : stainless steel & Aluminium alloy, Colour : Gold & Grey
> Cold steel blades. Designed for electronic BGA repairs.
> Package contains : 1 x QIANLI TOOLPLUS 008 Non-slip stainless steel handle & 3 x QIANLI TOOLPLUS 008 cold steel blades
|Colour||Gold & Grey|
|- Note : We are not responsible for any damage caused while attempting any repairs.|